Apple will not use TSMC 2nm chip for the M5 chip at high cost and will use SoIC packages at the end of 2025

Apple has reportedly ordered next-generation M5 chips from TSMC for its new iPad Pro and Macs. Mass production is expected in the second half of 2025.

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In a new report from TheElec, we learn that Apple’s new M5 chips will be manufactured on TSMC’s new 3nm process node, rather than the previously expected advanced 2nm node. Apple’s current generation M4 chips are manufactured on TSMC’s 3nm process node, but the new M5 chips will most likely NOT be manufactured on a 2nm process basis due to higher costs.

Instead, Apple is expected to use TSMC’s new System-on-Integrated-Chip (SoIC) technology, with the 3D chip stacking approach improving thermal management and electrical losses compared to traditional 2D designs for its new M5 processors reduced.

Apple has reportedly expanded its collaboration with TSMC for next-generation hybrid SoIC packaging technology, which also combines thermoplastic carbon fiber composite molding technology. This new packaging technology reportedly entered a small test production phase in July 2024.

Apple’s new M5 processors are expected to be used in new iPad Pros and Macs, but also in Apple’s AI server farms. Since the company uses a dual-use SoIC design, according to a certain report, Apple can use its new M5 processor in its AI server infrastructure to leverage its AI capabilities on both consumer devices (iPads, Macs, etc.) and Increase cloud services.